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【獵頭職位：深圳需要一位Thermal Engineer-Shenzhen】聯(lián)系人：Grace-Tai，郵箱：hr@kthr.com，微信也可查詢職位啦！打開(kāi)手機(jī)微信，搜號(hào)碼“KTHR_COM”或查找微信公眾帳號(hào)“KT人才”或掃描以上二維碼即可添加，歡迎大家關(guān)注！ 1.Have background of both mechanical designand thermal design working experiences in the mobile/communication industry. 2.Responsible for delivering qualifieddesigns of mechanical PCB stack-up, peripheral electromechanical parts, mobiledevice plastics and metal enclosures, and effective hardware thermal design forQualcomm Reference Design platforms. 3.Required to work seamlessly with hardwaredevelopment and validation teams on modeling, testing, analysis and debuggingfor mechanical, EMC/ESD, reliability and thermal issues of smartphone andtablets. 4.On the basis of hardware system design,this role, with close collaboration with marketing, program manager, sourcingas well as chipset design teams, is responsible for product definitionbreak-down, high-level ID and mechanical evaluation, key components selection,mechanical BOM management, technical risk prediction, etc. 5.The job also includes close interactionwith vendors, CMs and customer engineering teams for tooling, sampling, factoryon-site assistance, customer programs design-in and design issue technicalsupport. 6.This job provides mechanical/thermaldesign deliverables by making use of mechanical CAD tool of Pro/E and thermalsimulation tool of AnsysIcepak or Mentor FloTHERM. 7.Responsibilities Candidate is expected to have beenworking dependently on ID evaluation, PCB stack-up design, low-level mechanicaldesign of overall smartphone and tablet devices, and have efficiently delivereda couple of qualified designs to mass production for previous employers.Candidate is also required to have deep understanding of materials, finish andcost of mobile device mechanics. 8.Candidate should have rich knowledge ofthermal design for mobile devices as well as strong willingness to keep doingresearch on cooling systems. Candidate is required to be have extensiveknowledge on thermal simulation tool and methodologies, thermal mechanicalarchitecture, thermal testing and debugging. 9.Better to be familiar with mobileindustry, supply chain, ODM/OEM/IDH, carriers and chipset vendors. 10.Good team-work and cooperation spirit,good time-management and strong self-motivation are required. 11.Leadership and related experiences ofmobile device designs/projects as the technical lead, and good documentation/reportingcapability are the PLUS. 12.Good English and Chinese communicationskills (written and verbal). 13.Familiar with tools of Pro/E, Icepak orFloTHERM. 14.Minimum 5~6 yrs mechanical designworking experience. 15.Minimum 2~3 yrs thermal design workingexperience. 
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